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Productinfo

Ceramic plate and ring for polishing sapphire wafer

Item No: SCL05

Product Description

 

  

We could supply customers ceramic plates for CMP polishing with various outer diameter and thickness. 

This kind of table could be used for CMP polishing of 3,4,5,6 inch wafer. it has advantages such as high 

flatness and parallelism, compact and uniform microstructure and high cost performance. Some of them 

could achieve superior imported product level.

 

Spare parts of Ceramic plates and ring for polishing can be made according to customers’ requirement.