New Products
Productinfo
Product Description
Electroplating bond ultrthin dicing hub blade is one of upscale new products developed by our institution in last few
years, which are used to groove, cut, and dice silicon, compound semiconductors, glass, ceramics, crystals, and almost
any other material in electronic information industry. This product has high precision and long life, and cut performaance
has achieved or approaches the overseas advanced level.
Specification:
Example part number: