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precise polishing film
Item No: PP00
Product Description
lapping film Description
SIGNI lapping film is coated with precisely graded minerals (such as diamond, aluminum oxide, silicon carbide, silicon oxide, cerium oxide and so on) on the high strength polyester backing to provide a uniform, consistent finish. Available in 0.01-45 μm grades, with or without PSA (Pressure Sensitive Adhesive) backing.
Specification
|
Type
|
D
(Diamond)
|
SC
(Silicon Carbide)
|
AO
(Aluminum Oxide)
|
CO
(Cerium Oxide)
|
SO
(Silicon Oxide)
|
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|
Grit Size /
µm
|
30
|
Green
|
Light Green
|
Green
|
|
|
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|
20
|
|
|
White
|
|
|
|||||
|
16
|
|
|
White
|
|
|
|||||
|
15
|
Yellow-
green
|
Tawny
|
Light Green
|
Brown
|
|
|
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|
12
|
|
|
Yellow
|
|
|
|||||
|
9
|
Blue
|
Gray-green
|
Blue
|
|
|
|||||
|
6
|
Yellow
|
|
|
|
|
|||||
|
5
|
|
Gray-green
|
White
|
|
|
|||||
|
3
|
Pink
|
Tan
|
Pink
|
White
|
|
|
||||
|
2
|
|
Gray-green
|
Bright Green
|
|
|
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|
1
|
Off-white
|
Lavender
|
Gray-green
|
Blue
|
|
|
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|
0.5
|
Off-white
|
Brown-
yellow
|
|
White
|
Dark Red
|
Off-white
|
|
|||
|
0.3
|
|
|
White
|
Dark Red
|
Off-white
|
|
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|
0.2
|
Grey
|
|
|
|
|
|
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|
0.1
|
Light Brown
|
|
White
|
|
|
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|
0.02
|
|
|
|
|
Transparent
|
|||||
|
0.01
|
|
|
|
|
Transparent
|
|||||
|
Recommended Polishing Medium
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
SOQ-12D
|
Water
|
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|
Standard size
|
Disk :Φ70mm\Φ110mm\Φ127mm(5inch)\Φ203mm(8inch)
Sheet :114mm*114mm\152mm*152mm(6inch)\228mm*228mm(9inch)
|
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|
Note: Other film sizes are available upon request.
|
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Feature
·High removal rate and superior surface finishing
·Consistent finishing performance
·High durability and cost reduction
·Available for dry polishing and wet polishing
We are China lapping film manufacturer offer best lapping film OEM, ODM,service.
Application
|
Type
|
Main application
|
|
D
|
·Used to radius ferrule connectors or refine the finish in preparation for the final polish.
·Polishing for magnetic heads and hard disks
·Lapping and polishing for optical glasses, optical crystal , LED
·Lapping and polishing for Semiconductor wafer (gallium arsenide, indium phosphide etc.)
|
|
SC
|
·Epoxy and glass removal
·Lapping and polishing for plastic ferrules
·Fine finishing and polishing for magnetic heads
|
|
AO
|
·Polishing for fiber optical connectors
·Polishing for silicon wafer used in Solar cells
·Polishing for hard disks
·Polishing for ITO
·Lapping and polishing for optical crystal
|
|
CO
|
·The final polishing for fiber optical connectors
·Polishing for optical devices
|
|
SO
|
·The final super-precise polishing of optical fiber connector
|
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