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Sapphire Wafer Back grinding wheel

Item No: 05

Product Description

APPLICATION: Used for back side thinning and front side precision grinding of silicon sapphire wafer. FEATURES: 1.Various directions of producing chemicals or metallurgical products.Provide with high efficiency of grinding and durable lifetime. 2.Stably manufacture technics.Provide with fine roughness of wafer surface. SPECIFICATION: Bond:Resin,Vitrified. External diameter:φ175,φ195,φ209,φ305,φ335. Grit size:100#~3000#(8000# in developing). APPLICABLE EQUIPMENT: Be used on machines manufactured by DISCO,OKAMOTO.TSK,STRASBAUGH,ect.

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