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Sapphire Wafer Back grinding wheel
Item No: 05
Product Description
APPLICATION: Used for back side thinning and front side precision grinding of silicon sapphire wafer. FEATURES: 1.Various directions of producing chemicals or metallurgical products.Provide with high efficiency of grinding and durable lifetime. 2.Stably manufacture technics.Provide with fine roughness of wafer surface. SPECIFICATION: Bond：Resin,Vitrified. External diameter:φ175,φ195,φ209,φ305,φ335. Grit size:100#~3000#（8000# in developing）. APPLICABLE EQUIPMENT: Be used on machines manufactured by DISCO,OKAMOTO.TSK,STRASBAUGH,ect.
For your inquiry pls contact as below:
WhatsApp/wechat:+86 15821847679
EmaiL: sales@signicn.com
