Product Description

SIGNI Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity deionized water, highly engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on the pH.
SIGNI CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. Signi supplies CMP polishing slurry to customers around the world and is the most competitive in quality and price.
Features
High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
High purity: the content of Cu2+<50 ppb, without contamination on the work piece
Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface